Image sensor module with passive component

ABSTRACT

An image sensor module with passive component includes a flexible print circuit board having an upper surface, which is formed with a plurality of electrically circuits, and a lower surface. At least a passive component is arranged on the upper surface of the flexible circuit board. A substrate has a first surface, a second surface, and a penetrated hole. The second surface of the substrate is mounted on the upper surface of the flexible circuit board, so that the passive component is located within the penetrated hole. A chip is mounted on the first surface of the substrate, and is located onto the penetrated hole of the substrate. A plurality of wires are electrically connected the chip to the substrate. A lens holder is mounted on first surface of the substrate, and is formed with an internal thread. And a lens barrel is formed with an external thread screwed on the internal thread of the lens holder, the lens barrel formed with an opening, an aspheric lens, and an infrared filter.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates an image sensor module with passive component, andparticular to a structure for packaging image sensor module, the size ofthe package may be decreased, and the manufacturing cost may bedecreased.

2. Description of the Related Art

Referring to FIG. 1, it is an image sensor module structure includes asubstrate 10, frame layer 18, a chip 26, a plurality of wires 28,transparent layer 34, a lens holder 35 and a lens barrel 46.

The substrate 10 has an first surface 12 on which plurality of firstelectrodes 15 are formed, and a second surface 14 on which plurality ofsecond electrodes 16 are formed, the first electrodes 15 arecorresponding to electrically connect to the second electrodes 16.

The frame layer 18 has a upper surface 20 and a lower surface 22, thelower surface 22 of the frame layer 18 is adhered on the first surface22 of the substrate 10 to form a cavity 24.

The chip 26 is arranged on the first surface 12 of the substrate 10, andis located within the cavity 24, and is formed with bonding pads 27.

The wire 28 has a first end 30 and a second end 32, the first end 30 iselectrically connected the bonding pad 27 of the chip 26, the second end30 is electrically connected the first electrodes 15 of the substrate10.

The transparent layer 34 is adhered on the upper surface 20 of the framelayer 18.

The lens holder 35 has an upper end surface 36, a lower end surface 40,and a penetrated region 42, which is formed with internal thread 44.

The lens barrel 46 is formed with external thread 39 screwed on theinternal thread 44 of the lens holder 35, an opening 47, an asphericlens 481, and an infrared filter 49.

Please refer to FIG. 2, the substrate 10 is mounted on a flexible printboard 55, the second electrodes 16 of the substrate 10 are electricallyconnected to the flexible print board 55, which is formed with passivecomponent 57, therefore, the module is used to connect to a electricaldevice by the flexible print board 55.

SUMMARY OF THE INVENTION

An objective of the invention is to provide an image sensor module withpassive component, and capable of decreasing the size of the module.

Another objective of the invention is to provide an image sensor modulewith passive component, and capable of increasing the reliability of themodule.

To achieve the above-mentioned object, the invention includes a flexibleprint circuit board having an upper surface, which is formed with aplurality of electrically circuits, and a lower surface. At least apassive component is arranged on the upper surface of the flexiblecircuit board. A substrate has a first surface, a second surface, and apenetrated hole. The second surface of the substrate is mounted on theupper surface of the flexible circuit board, so that the passivecomponent is located within the penetrated hole. A chip is mounted onthe first surface of the substrate, and is located onto the penetratedhole of the substrate. A plurality of wires are electrically connectedthe chip to the substrate. A lens holder is mounted on first surface ofthe substrate, and is formed with an internal thread. And a lens barrelis formed with an external thread screwed on the internal thread of thelens holder, the lens barrel formed with an opening, an aspheric lens,and an infrared filter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustration showing a conventionalimage sensor module package.

FIG. 2 is a schematic illustration showing a conventional image sensormodule package.

FIG. 3 is a first illustration showing an image sensor module withpassive component of the present invention.

FIG. 4 is a second illustration showing an image sensor module withpassive component of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Please refer to FIG. 3, an image sensor module with passive componentincludes a flexible print board 50, passive component 51, substrate 52,achip 54, wires 56, a lens holder 50, and a lens barrel 60.

The flexible print circuit board 50 has an upper surface 62, which isformed with a plurality of electrically circuits 66, and a lower surface61.

The passive component 51 is arranged on the upper surface 62 of theflexible circuit board 50, and is electrically connected to theelectrically circuits 66 of the flexible circuit board 50.

The substrate 52 has a first surface 68, a second surface 70, and apenetrated hole 72, the first surface 68 is formed with first electrodes74, the second surface 70 is formed with second electrodes 76, thesecond surface 70 of the substrate 52 is mounted on the upper surface 62of the flexible circuit board 50, and the second electrodes 76 of thesubstrate 52 are electrically connected the electrically circuit 66 ofthe flexible print circuit board 50, so that the passive component 51 islocated within the penetrated hole 72.

The chip 54 is mounted on the first surface 68 of the substrate 52, andis located onto the penetrated hole 72 of the substrate 52. The chip 54is formed with bonding pads 78.

The plurality of wires 56 are electrically connected the bonding pads 78of the chip 54 to the first electrodes 74 of the substrate 52.

The lens holder 58 is mounted on first surface 68 of the substrate 52 tosurround the chip 54, and is formed with an internal thread 80. And

The lens barrel 60 is formed with an external thread 82 screwed on theinternal thread o80 f the lens holder 58, the lens barrel 60 is formedwith an opening 84, an aspheric lens 86, and an infrared filter 88.

Please refer to FIG. 4, an image sensor module with passive componentincludes a flexible print board 50, passive component 51, substrate 52,frame layer 53, a chip 54, wires 56, a lens holder 50, and a lens barrel60.

The flexible print circuit board 50 has an upper surface 62, which isformed with a plurality of electrically circuits 66, and a lower surface61.

The passive component 51 is arranged on the upper surface 62 of theflexible circuit board 50, and is electrically connected to theelectrically circuits 66 of the flexible circuit board 50.

The substrate 52 has a first surface 68, a second surface 70, and apenetrated hole 72, the first surface 68 is formed with first electrodes74, the second surface 70 is formed with second electrodes 76, thesecond surface 70 of the substrate 52 is mounted on the upper surface 62of the flexible circuit board 50, and the second electrodes 76 of thesubstrate 52 are electrically connected the electrically circuit 66 ofthe flexible print circuit board 50, so that the passive component 51 islocated within the penetrated hole 72.

The frame layer 53 is arranged on the first surface 68 of the substrate52 to form a cavity 59.

The chip 54 is mounted on the first surface 68 of the substrate 52, andis located within the cavity 59. The chip 54 is formed with bonding pads78.

The plurality of wires 56 are electrically connected the bonding pads 78of the chip 54 to the first electrodes 74 of the substrate 52.

The transparent layer 61 is mounted on the frame layer 53 to cover thechip 54.

The lens holder 58 is mounted on frame layer 53, and is formed with aninternal thread 80. And

The lens barrel 60 is formed with an external thread 82 screwed on theinternal thread o80 f of the lens holder 58, the lens barrel 60 isformed with an opening 84, an aspheric lens 86, and an infrared filter88.

While the invention has been described by the way of an example and interms of a preferred embodiment, it is to be understood that theinvention is not limited to the disclosed embodiment. On the contrary,it is intended to cover various modifications. Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications.

1. An image sensor module with passive component, the module comprising; a flexible print circuit board having an upper surface, which is formed with a plurality of electrically circuits, and a lower surface; at least a passive component arranged on the upper surface of the flexible circuit board, and electrically connected to the electrically circuits; a substrate having a first surface, a second surface, and a penetrated hole, the first surface formed with first electrodes, the second surface formed with second electrodes, the second surface of the substrate mounted on the upper surface of the flexible circuit board, so that the passive component located within the penetrated hole; a chip mounted on the first surface of the substrate, and located onto the penetrated hole of the substrate; a plurality of wires electrically connected the chip to the first electrodes of the substrate; a lens holder mounted on first surface of the substrate, and formed with an internal thread; and a lens barrel formed with an external thread screwed on the internal thread of the lens holder, the lens barrel formed with an opening, an aspheric lens, and an infrared filter.
 2. The image sensor module with passive component according to claim 1, wherein the second electrodes of the substrate are electrically connected to the electrically circuit of the flexible circuit board.
 3. An image sensor module with passive component, the module comprising; a flexible print circuit board having an upper surface, which is formed with a plurality of electrically circuits, and a lower surface; at least a passive component arranged on the upper surface of the flexible circuit board, and electrically connected to the electrically circuits; a substrate having a first surface, a second surface, and a penetrated hole, the first surface formed with first electrodes, the second surface formed with second electrodes, the second surface of the substrate mounted on the upper surface of the flexible circuit board, so that the passive component located within the penetrated hole; a frame layer arranged on the first surface of the substrate to form a cavity; a chip mounted on the first surface of the substrate, and located onto the penetrated hole of the substrate, arranged within the cavity; a plurality of wires electrically connected the chip to the first electrodes of the substrate; a transparent layer mounted on the frame layer to cover the chip; a lens holder mounted on first surface of the substrate, and formed with an internal thread; and a lens barrel formed with an external thread screwed on the internal thread of the lens holder.
 4. The image sensor module with passive component according to claim 1, wherein the second electrodes of the substrate are electrically connected to the electrically circuit of the flexible circuit board.
 5. The image sensor module with passive component according to claim 1, wherein the lens barrel is formed with an opening, an aspheric lens, and an infrared filter. 